超薄金刚石切割片

  用于对切割缝隙要求比较小的手机面板及多晶硅等产品。主要厚度：0.3mm,0.4mm 外径尺寸和中孔安装尺寸可根据用户要求定制。

  Used for mobile phone panels and polycrystalline silicon products that require relatively small cutting gaps.Main thickness:0.3mm,0.4mm,outer diameter size and middle hole installation size can be customized according to user requirements.